FEVM Launches FA-EX9 Mini PC Featuring AMD Ryzen AI MAX+ 395 “Strix Halo”
Chinese computer manufacturer FEVM has unveiled its latest compact computing device, the FA-EX9 mini PC. This system is powered by AMD’s recently launched Ryzen AI MAX+ 395 processor, codenamed “Strix Halo,” and is designed to provide desktop-grade performance in a compact 2-liter chassis.
The FA-EX9 measures 192 × 190 × 55 mm and is built around AMD’s new processor that features 16 Zen 5 CPU cores and 40 RDNA 3.5 compute units. These graphics units are integrated under the Radeon 8060S moniker. In addition, the processor includes an XDNA 2 neural processing engine capable of delivering up to 50 trillion operations per second (TOPS), aimed at accelerating AI-related tasks locally.
FEVM has configured the processor to run at a sustained power level of up to 120 watts, which places it in the same category as high-end laptop chips such as the Ryzen 9 9955HX when paired with a discrete NVIDIA RTX 4070 Laptop GPU. With this setup, the FA-EX9 targets users who require a combination of compute and graphics power in a compact format, such as developers, AI researchers, and content creators.
The system includes 128 GB of LPDDR5X memory connected via a 256-bit bus, allowing up to 96 GB of it to be dynamically allocated as video memory. This configuration supports large model inference workloads, typically used in machine learning and creative software.
Storage is handled by two M.2 PCIe 4.0 SSD slots, supporting up to 2 TB internally and a maximum of 16 TB through additional expansion. In terms of connectivity, the FA-EX9 offers one HDMI 2.1 port, one DisplayPort 1.4, and two USB4 Type-C ports. These enable support for up to four 8K displays. The inclusion of an OCuLink port provides the option for external GPU expansion, giving users additional performance flexibility depending on their workload.
Although not officially confirmed, the design and specifications of the FA-EX9 appear to take inspiration from NVIDIA’s DGX Spark. That device is a compact AI system featuring the GB10 Grace Blackwell superchip, which combines a 20-core Arm CPU with a Blackwell GPU. The DGX Spark delivers up to 1,000 FP4 AI TOPS and is targeted at users focused on AI development and clustering solutions.
The DGX Spark also includes 128 GB of LPDDR5X memory and up to 4 TB of encrypted NVMe storage. It supports fast networking with a 200 GbE SmartNIC and offers four USB4 ports and one HDMI output in a 1.24-liter chassis, drawing around 170 W under full load. Pricing starts at $2,999 for the base model.
While the DGX Spark emphasizes high-throughput AI processing, FEVM’s FA-EX9 appears to serve a more general-purpose role. It offers users a compact yet flexible system that can be tailored for AI tasks, creative applications, and even gaming, thanks to its GPU support and wide range of I/O options.
As of now, FEVM has not announced pricing or availability for the FA-EX9.
