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GEEKOM A9 Max Mini PC Launches with AMD Ryzen AI 9 HX 370 and $1,199
GEEKOM has announced the upcoming release of its latest compact system, the A9 Max Mini PC, with the official launch scheduled for August 21 at 13:00 Eastern Time. Despite the set announcement date, the product is already listed on the company’s official website, confirming its specifications and pricing.
The GEEKOM A9 Max is powered by the AMD Ryzen AI 9 HX 370 processor, designed to deliver strong performance in a small footprint. The system uses an all-metal chassis and GEEKOM’s IceBlast 2.0 cooling solution, which integrates a copper base, dual heat pipes, copper fins, and a turbo fan to handle demanding workloads. The device measures 132 × 135 × 46.9 mm, offering a compact 0.836-liter volume suitable for space-limited setups.

In terms of hardware expandability, the A9 Max provides two DDR5 SODIMM slots for memory upgrades and two PCIe 4.0×4 M.2 slots (2280 and 2230) for storage expansion. Connectivity options include Wi-Fi 7 and Bluetooth 5.4, enabling faster and more stable wireless performance.
The external ports are designed for versatility. The front panel includes four USB-A 10Gbps ports, a 3.5 mm audio jack, and the power button. On the back, users will find two USB4 Type-C ports with DisplayPort Alt Mode, two 2.5 GbE RJ45 ports, two HDMI 2.1 outputs, one USB-A 10Gbps, and one USB-A 480Mbps port, along with the DC-in power connector. Additional features include an SD 4.0 card reader on one side and a Kensington security slot on the other.
GEEKOM emphasizes the durability of the A9 Max, noting that it has passed 90 minutes of vibration testing, 330 hours of stability trials, and 120 hours of operation in temperatures ranging from -20°C to +55°C. The Mini PC comes with a 3-year warranty.
Currently, the system is only available in a 32GB RAM + 2TB SSD configuration, priced at USD $1,199 on GEEKOM’s website. The listing indicates that buyers can place orders ahead of the official announcement, with availability expected to expand following the August 21 launch event.
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